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Patent Searching and Data


Title:
MOLD-RELEASE FILM
Document Type and Number:
Japanese Patent JPH11240110
Kind Code:
A
Abstract:

To provide a mold-release film excellent in surface smoothness, especially, in surface smoothness at a time of high temp. and useful for a resin sheet or film molded from a resin soln., a molding carrier film such as a ceramic sheet or the like molded from a ceramic slurry or a protective film of a self-adhesive layer of a self-adhesive tape or the like.

A mold-release film comprises a polyalkylene 2,6- naphthalenedicarboxylate containing 0.005-5 wt.% of inert particles and is characterized by that the absolute value of the dimensional change ratio of the mold- release film under a stress of 150 gf/mm2 at 120°C is 0.2% or less in both of longitudinal and vertical directions and the number of particles with a particle size of 50 μm or less in the film is 100/m2 or less and the surface roughness of the mold-release surface of the film is 2-50 nm.


Inventors:
SUMI HIROYUKI
Application Number:
JP4369898A
Publication Date:
September 07, 1999
Filing Date:
February 25, 1998
Export Citation:
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Assignee:
TEIJIN LTD
International Classes:
B32B27/00; B29D7/01; B32B27/36; C08K3/36; C08L67/02; B29K23/00; (IPC1-7): B32B27/00; B29D7/01; B32B27/36; C08K3/36; C08L67/02
Attorney, Agent or Firm:
Maeda Junhiro