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Title:
MOLD FOR MOLD RESIN INJECTION MOLDING
Document Type and Number:
Japanese Patent JP2012121257
Kind Code:
A
Abstract:

To provide a technology for carrying out high reliable gate cut without applying an unreasonable load on a mold for mold resin injection molding while many of injection molding two-plate mold structures adopting side gate systems have problems that a molded article, and a sprue and a runner being unnecessary portions are discharged from the mold in a connected state, and after that, a step of separating the molded article from the sprue and runner performed manually or by using a robot is necessary in order to cut the gate.

In the two-plate mold structure adopting the side gate 9 system of the mold for mold resin injection molding, the sprue 12 and the runner 13 are separated from the molded article by incorporating a sprue bush and a rotary sleeve 2 rotatable in the center axis direction of the sprue bush, and rotating the rotary sleeve in which a gate groove 16 is formed at a runner groove 10 of a fixed sprue bush to block a flow path to a molding part.


Inventors:
HIRANO TORU
OKUBO ISAMU
Application Number:
JP2010274814A
Publication Date:
June 28, 2012
Filing Date:
December 09, 2010
Export Citation:
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Assignee:
HITACHI IND EQUIPMENT SYS
International Classes:
B29C45/38
Domestic Patent References:
JP2003080569A2003-03-19
JPH01310926A1989-12-15
JPH01264821A1989-10-23
Attorney, Agent or Firm:
Polaire Patent Business Corporation