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Patent Searching and Data


Title:
MOLDING DIE, EQUIPMENT AND MOLDING METHOD
Document Type and Number:
Japanese Patent JP2001018230
Kind Code:
A
Abstract:

To provide a molding die, equipment and a molding method by which FRP moldings can be speedily formed without necessitating a large-scale installation.

In the resin molding die, a molding space 3 is formed on the opposite faces of a plurality of matched molds 1, 2. A large number of material injection parts 4 are formed on the surface in nearly uniform distribution rows for the width of the molding space 3 so as to reach the molding space 3 from the outside. A large number of exhaust holes 5 are formed apart from the respectively material injection parts 4 in the nearly uniform distribution rows for the width of the molding space 3 so as to reach the molding space 3 from the outside. In a method for pressurizing compounded resin and filling it into the molding space 3 of the molding die from the material injection parts 4, the compounded resin is simultaneously injected at the same pressure from the many material injection parts 4 connected with a pressurizing device and together therewith pressure reduction is simultaneously performed at the same pressure through many exhaust holes 5 connected to a vacuum device and the compounded resin is charged.


Inventors:
SUZUKI MASAHIKO
Application Number:
JP19716599A
Publication Date:
January 23, 2001
Filing Date:
July 12, 1999
Export Citation:
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Assignee:
FJC KK
SUZUKI MASAHIKO
International Classes:
B29C31/04; B29C33/10; B29C33/38; B29C43/02; B29C43/34; (IPC1-7): B29C33/10; B29C31/04; B29C33/38; B29C43/02; B29C43/34
Attorney, Agent or Firm:
Shoichi Takezawa (2 outside)