Title:
MOLDING MATERIAL FOR SEMICONDUCTOR SEALING, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2020132800
Kind Code:
A
Abstract:
To provide: a molding material for semiconductor sealing and a method for manufacturing the same which are capable of achieving excellent appearance and reliability of a semiconductor device even if a resin thickness on a chip of a semiconductor package becomes as small as 100 μm or less; and a semiconductor device using the molding material for semiconductor sealing.SOLUTION: A molding material for semiconductor sealing includes, as a blending component, an epoxy resin, a curing agent and an inorganic filler. A total content of one or more kinds selected from among aggregates whose size exceeds 100 μm and gelatinous materials is 50 mass ppm or below.SELECTED DRAWING: None
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Inventors:
KONNO YOSHIMASA
MAEDA TAKESHI
MAEDA TAKESHI
Application Number:
JP2019030729A
Publication Date:
August 31, 2020
Filing Date:
February 22, 2019
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
C08L63/00; B29B9/04; B29B13/10; C08J3/12; C08K3/013; H01L21/56; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Otani patent office