To provide a method for preventing corrosion and disconnection of an electrode through suppressing the cell reaction at the connection of electrode, which is connected with a conductive binder in a high humidity and temperature atmosphere.

To connect a mounting electrode 2a, composed of Al and Al compounds for TFT array board with the IC electrode 6 composed of Al-Si-Cu, the conductive binder 8 comprising the conductive particle 8a composed of either particles of Ti or Ta, or particles of resin plate with Ti or Ta. Because the potential difference between Al and Ti or Ta is retained around 0.9 V as well as the potential difference between Al-Si-Cu and Ti or Ta is maintained around 1.5 V, the cell reaction between the IC electrode 6 and the mounting electrode 2a is suppressed to prevent corrosion of the electrode.