To provide a dense multilayer printed-circuit support and method for manufacturing it.
The method for manufacturing the multilayer printed-circuit support comprises a step of forming a core layer in which a circuit is formed in a copper foil surface adhered to both sides of a CCL using a resin layer as a base material, a step of printing a bump at a predetermined position in a surface of one side of the core layer, a step of forming an insulating layer in which a through-hole is formed through drilling at a position on a prepreg corresponding to the position in which the bump is printed, a step of forming a temporary attachment layer by temporarily attaching the insulating layer to the surface of the one side in which the bump is located in the formed core layer, and a step of laminating the layers so that the core layer is contact with the insulating layer in the temporary attachment layer and heating and pressurizing at more than a predetermined level.
RYU CHANG-SUP
KIM TAE-KYUN
SEO BYON-BAE
OH YOONG
SHIN HEE-BUN
SEO YOUN SOO
PARK DON-JIN
