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Title:
MULTTLAYERED CIRCUIT ASSEMBLY* TERMINALS AND METHOD OF MANUFACTURING SAID ASSEMBLY
Document Type and Number:
Japanese Patent JPS51145858
Kind Code:
A
Abstract:
A method of making a multilayered circuit assembly from a plurality of flat, flexible circuit elements, wherein each circuit element includes a substrate having conductive means to define an electrical path of travel which is formed between a base layer made of insulation material and a cover layer made of insulation material. Each circuit element has a connecting station associated with the conductive means. The method generally includes the steps of forming the conductive means on the base layer of each circuit element, punching a first opening through the conductive means and base layer at a connecting station of each circuit element, soldering the connecting station of each circuit element so that a solid solder pad fills the first opening whereby the solder electrically contacts the conductive means, punching a second opening through the cover layer of each circuit element, securing the cover layer of each circuit element over the base layer and conductive means so that the first opening is generally concentric with the second opening, punching a third opening in each circuit element through the solder pad, stacking a plurality of punched and soldered circuit elements on top of one another so that the third openings are generally concentric, inserting a terminal into the third openings of the stacked circuit elements so that a portion thereof contacts the solder, and staking the terminal so that the other surface thereof forms a cold weld interference fit against the solder.

Inventors:
KURETASU JII MAKUDONOO
Application Number:
JP6299776A
Publication Date:
December 15, 1976
Filing Date:
June 01, 1976
Export Citation:
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Assignee:
MOLEX INC
International Classes:
H05K1/11; H01R4/06; H01R12/58; H01R12/61; H05K3/36; H05K3/40; H05K3/34; H05K3/46; (IPC1-7): H05K3/00; H05K3/30
Domestic Patent References:
JPS487381A
JPS4915184U1974-02-08
Foreign References:
US3325691A1967-06-13
US3391375A1968-07-02