Title:
UNSEALING EQUIPMENT OF PLASTIC MOLDED SEMICONDUCTOR DEVICE AND UNSEALING METHOD
Document Type and Number:
Japanese Patent JP2573806
Kind Code:
B2
Abstract:
PURPOSE: To enable accurately stopping dissolution of sealing resin at the time of exposure of the surface of a semiconductor chip when chemical liquid for unsealing cd sealing resin which is applied to imperfect IC investigation is colored like fuming nitric acid.
CONSTITUTION: The title unsealing equipment is provided with a chemical liquid tank 2, a chemical liquid pump 4, a spouting nozzle 3, a laser light source 5 which radiates a spot shaped incident laser light 161 so as to have an angle of inclination to a semiconductor device 1 to be unsealed, and a CCD linear image sensor 6 which receives reflected laser light 16R. The reflection position in a semiconductor device 1 is detected by the CCD linear image sensor 6, form the light receiving portion of the reflected laser light 16R.
Inventors:
KANO HIDEKI
Application Number:
JP20646194A
Publication Date:
January 22, 1997
Filing Date:
August 31, 1994
Export Citation:
Assignee:
YAMAGATA NIPPON DENKI KK
International Classes:
H01L21/66; H01L21/56; H01L27/14; (IPC1-7): H01L21/56; H01L21/66
Domestic Patent References:
| JP2260549A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)