Title:
SMOOTHING WIRING CIRCUIT BOARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP2538472
Kind Code:
B2
Abstract:
PURPOSE: To slide a slider sliding on a wiring pattern smoothly by burying and forming the wiring pattern formed onto a board so as to be shaped in the same height as the board.
CONSTITUTION: An insulating sheet 15 under the state of a B stage is stuck on one side of a thermoplastic insulating board 11, conductive pattern sections 16-18 having different resistance values at start ends and terminals are formed to the insulating sheet 15 while conductor patterns 7-9 constituting the electrode sections of the conductive patterns 16-18 are formed onto the thermoplastic insulating board 11, the height of both patterns is set in the same height when the insulating sheet 15 is heated and cured, and a slider can be slid and moved smoothly on the conductive pattern sections 16-18.
Inventors:
TAKINO HIDEO
HASHIZUME OSAMU
KIMURA NOBUMASA
TSUNEKAWA SHIGEKI
HASHIZUME OSAMU
KIMURA NOBUMASA
TSUNEKAWA SHIGEKI
Application Number:
JP35929291A
Publication Date:
September 25, 1996
Filing Date:
December 27, 1991
Export Citation:
Assignee:
AICHI ELECTRIC CO LTD
International Classes:
H01C10/32; H01C17/06; H05K1/16; H05K3/22; (IPC1-7): H01C10/32; H01C17/06; H05K1/16; H05K3/22
Domestic Patent References:
| JP3204902A | ||||
| JP1225302A | ||||
| JP59115505A |