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Title:
NON-CONTACT IC TAG HAVING IC CHIP BREAKDOWN PREVENTION STRUCTURE, CONNECTING ELEMENT OF THE NON-CONTACT IC TAG, AND MANUFACTURING METHOD OF THE NON-CONTACT IC TAG CONNECTING ELEMENT
Document Type and Number:
Japanese Patent JP2007279782
Kind Code:
A
Abstract:

To provide a non-contact IC tag for preventing an IC chip of the non-contact IC tag from being broken by external force applied, and also to provide a manufacturing method of the tag.

A non-contact IC tag 1 having an IC chip breakdown preventing structure includes a dipole antenna 2 formed on one face side of a base film 11 and an IC chip 3 mounted on the antenna 2, and also has a surface protective sheet mounted thereon. Two sheets of strip-like structures 10a, 10b are arranged at intervals, so as to form parallel grooves 9 orthogonal to the length direction of the antenna 2, on both sides of the IC chip 3, and the IC chip 3 is positioned in the grooves 9. The IC tag 1 may be formed as an IC tag connecting element, and the protective sheet may not be necessary. The strip-like structures 10 may be papers or plastic films having uniform thickness of 50 μm to 250 μm.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
OGATA TETSUJI
Application Number:
JP2006101315A
Publication Date:
October 25, 2007
Filing Date:
April 03, 2006
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
G06K19/077; G06K19/07
Domestic Patent References:
JP2006039854A2006-02-09
JP2002525726A2002-08-13
JP2006023814A2006-01-26
Attorney, Agent or Firm:
金山 聡
深町 圭子
伊藤 英生
藤枡 裕実
後藤 直樹