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Patent Searching and Data


Title:
NON-CONTACT TYPE IC CARD
Document Type and Number:
Japanese Patent JPH08194801
Kind Code:
A
Abstract:

PURPOSE: To prevent the formation of a level difference or bulge on a surface part and to obtain a flat surface state and an IC card preventing an IC card element from being exposed to the surface by containing electrical insulating reinforcing fibers in both the surface parts of a synthetic resin sheet to be used for forming a card by laminated structure.

CONSTITUTION: This non-contact type IC card is constituted of an IC card element embedded in a card formed by the laminated body of synthetic resin sheet. Namely the non-contact type IC card 10 is provided with three-layer structure consisting of a surface layer, an intermediate layer and a surface layer. An IC card element 13 is arranged on a punched part 11 formed on the center part of the sheet 1 and surface layer sheets 2, 3 containing electrical insulating reinforcing fibers 6 are laminated on both the surfaces of the sheet 1. In this three-layer structure, the reinforcing fibers 6 are contained at least in both the upper and lower surface parts of the IC card element 13.


Inventors:
IMAI TAKAYOSHI
OKUYAMA KATSUMI
NEMOTO YOUSUI
Application Number:
JP2346095A
Publication Date:
July 30, 1996
Filing Date:
January 18, 1995
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP
International Classes:
B42D15/10; G06K19/07; G06K19/077; (IPC1-7): G06K19/07; B42D15/10; G06K19/077
Attorney, Agent or Firm:
Kazuhiko Okada