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Title:
OPTICAL SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2005189605
Kind Code:
A
Abstract:

To provide a low cost optical semiconductor module which can be manufactured without using a high cost process such a polishing process and in which countermeasures to reflective return light of surface emitting laser or the like is taken into account.

An optical fiber directly after cutting with a fiber cutter is inserted into an opto-electric ferrule provided with an optical transmission path guide and an optical device mounting electrode and fixed. A transparent resin spacer is inserted to adjust an optical coupling distance.


Inventors:
FURUYAMA HIDETO
HAMAZAKI HIROSHI
Application Number:
JP2003000432232
Publication Date:
July 14, 2005
Filing Date:
December 26, 2003
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
G02B6/42; H01L31/0232; H01S5/022; (IPC1-7): G02B6/42; H01L31/0232; H01S5/022
Domestic Patent References:
JP2001159724A2001-06-12
JP2001127312A2001-05-11
JP2000208859A2000-07-28
JPH0990176A1997-04-04
JP2001059924A2001-03-06
JPH07218777A1995-08-18
JP2000062017A2000-02-29
JP2005189604A2005-07-14
JPH08254635A1996-10-01
JPH09127375A1997-05-16
JP2002267893A2002-09-18
JP2002164602A2002-06-07
JPH0250110A1990-02-20
Attorney, Agent or Firm:
外川 英明



 
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