To provide a package for an electronic part in which hermetic failure, short circuit and the like can be prevented and reliability on hermetic property can be improved with a simple constitution.

Junction patterns 10 and 11 are joined to a lid member 3 by a brazing filler metal 20. A space 12 for housing is hermetically sealed by the lid member 3. Since the width of the upper-layer junction pattern 11 is smaller than that of the lower-layer junction pattern 10, they form irregularities. Further, brazing filler metal reservoirs 21 for collecting the filler metal 20 are formed between the junction pattern 10 and the lid member 3. In consequence, the filler metal 20 is collected in the filler metal reservoirs 21, is not dropped into the space 12 for housing and has no void. Accordingly, the occurrence of short circuit is prevented and junction area is increased, reliability of hermeticity can be improved by increasing junction strength between the package 2 and the lid member 3.