Title:
PACKAGING DEVICE AND PACKAGING METHOD
Document Type and Number:
Japanese Patent JP2015151149
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a packaging device and packaging method capable of obtaining a package in which a packaged object and another small object can be packaged together, and another small object can move on a flat surface of the packaged object.SOLUTION: The packaging device includes conveyance mechanisms 40 and 60 for conveying a film band-shaped body 101 in which a packaged object 110 is loaded, a weld mechanism 30 for forming welded portions 1c and 1d in a folded portion 1h of the film band-shaped body in the conveyance direction X, a fusion-cutting mechanism 50 for fusion-cutting the film band-shaped body in the direction orthogonal to the conveyance direction, and a control section for controlling each operation of the conveyance mechanisms, the weld mechanism and the fusion-cutting mechanism. The control section controls each operation of the conveyance mechanisms and the weld mechanism so as to form a non-welded portion 1f not to be welded in a desired position in the folded portion along a weld scheduled portion 1m in which the welded portions are scheduled to be formed.
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Inventors:
YOROZU HIDENORI
OGURI KAZUHITO
OGURI KAZUHITO
Application Number:
JP2014025401A
Publication Date:
August 24, 2015
Filing Date:
February 13, 2014
Export Citation:
Assignee:
DUPLO SEIKO CORP
International Classes:
B65B51/10; B65B9/06; B65D75/58
Domestic Patent References:
JP2007062798A | 2007-03-15 | |||
JP2013121879A | 2013-06-20 | |||
JP2002096805A | 2002-04-02 | |||
JPH0413575U | 1992-02-04 | |||
JPS6278010A | 1987-04-10 | |||
JP2006264697A | 2006-10-05 |
Attorney, Agent or Firm:
Mitsuo Tanaka
Hiroshi Yamazaki
Yasushi Ohata
Yukino Okunishi
Hiroshi Yamazaki
Yasushi Ohata
Yukino Okunishi