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Title:
PACKAGING DEVICE OF MULTILAYER CERAMIC WIRING BOARD
Document Type and Number:
Japanese Patent JPH02112300
Kind Code:
A
Abstract:

PURPOSE: To facilitate the recognition of an attaching direction by fixing a multilayer ceramic substrate provided with an external connection pin to a flange and by providing a display means to recognize a section having an attaching indication of a multilayer ceramic wiring board to one of pin covers which are attached to four corners of the flange.

CONSTITUTION: A chip carrier 2 is packaged on a multilayer ceramic wiring board 1 which is provided with a pin for external connection. The multilayer ceramic wiring board 1 is fixed to a flange 3. The four corners of the flange 3 are stepped, and a pin cover 6 is attached by a screw 4 thereto, respectively. A hole 6b is shaped below a pin cover 6a having an attaching indication of the multilayer ceramic wiring board 1 whereon the chip carrier 2 is packaged to identify from two directions. Thereby, a state of a pin can be observed from four directions and an attaching direction of a multilayer ceramic wiring board can be also recognized at a glance.


Inventors:
KANEKO TOMOKAZU
Application Number:
JP26567188A
Publication Date:
April 24, 1990
Filing Date:
October 21, 1988
Export Citation:
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Assignee:
NEC CORP
International Classes:
H01L25/18; H01L25/04; H05K7/14; (IPC1-7): H01L25/04; H01L25/18; H05K7/14
Attorney, Agent or Firm:
Murao Mikio



 
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