Title:
PRINTING WIRING BOARD
Document Type and Number:
Japanese Patent JPH0774448
Kind Code:
A
Abstract:
PURPOSE: To provide a printed wiring board not requiring plating of the inside of the through holes before mounting electronic components.
CONSTITUTION: Lead wires of the electronic components are formed into coiled springs by means of a fine wire made of phosphor bronze, and the lead wires 12, 13 are inserted into the through holes 8, 9, dipped into molten solder and soldered so that solder 10 is sucked inside the through holes 8, 9 by means of capillarity of the fine wires forming the coiled springs so as to electrically connect lands at the same time of mounting the electronic components 11.
Inventors:
KAWAKAMI SHIN
KOGURE SATORU
KOINUMA YUICHI
SEKI NAOHIKO
KOGURE SATORU
KOINUMA YUICHI
SEKI NAOHIKO
Application Number:
JP16859793A
Publication Date:
March 17, 1995
Filing Date:
June 15, 1993
Export Citation:
Assignee:
NIPPON CMK KK
International Classes:
H01C1/14; H01G4/228; H05K1/11; H05K1/18; H05K3/34; H05K3/40; (IPC1-7): H05K1/18; H01C1/14; H01G4/228; H05K1/11
Attorney, Agent or Firm:
Takeshi Nara
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