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Title:
PARTICLE BOARD
Document Type and Number:
Japanese Patent JP2014008617
Kind Code:
A
Abstract:

To provide a particle board at low cost, having peel strength to be well maintained.

The particle board includes fibrous bamboo chips, wooden chips, and a thermosetting resin for bonding the bamboo chips and the wooden chips.


Inventors:
MURAKAMI KOICHI
MURAKAMI TOMOYOSHI
FUKUYA MASASHI
Application Number:
JP2012144825A
Publication Date:
January 20, 2014
Filing Date:
June 28, 2012
Export Citation:
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Assignee:
OKURA INDUSTRIAL CO LTD
International Classes:
B27N3/04; B27N3/06
Domestic Patent References:
JPH10152938A1998-06-09
JP2001096515A2001-04-10
JP2006341453A2006-12-21



 
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