PATTERN FORMATION METHOD, DROPLET JETTING DEVICE, AND CIRCUIT SUBSTRATE

Title:

PATTERN FORMATION METHOD, DROPLET JETTING DEVICE, AND CIRCUIT SUBSTRATE

Document Type and Number:

Japanese Patent JP2008155196

Kind Code:

A

Abstract:

To provide a pattern formation method, a droplet jetting device, and a circuit substrate capable of forming a high-precision pattern for a short time.

A stage 23 loads a green sheet 4G on a gas-permeable stage plate 23b and heats the green sheet 4G at a predetermined temperature with a rubber heater H provided at the lower side of the plate 23b. The stage 23 decompresses inside of the stage 23b by decompressing the lower side of the plate 23b through a suction path, thereby decompressing the entire lower side of the green sheet 4G loaded on the plate 23b. The droplet Fb impacted on the green sheet 4G further promoting evaporation towards inside of the green sheet 4G. This allows the drying time of a metal ink impacted on the green sheet 4G to be further shortened.

Inventors:

TOYODA NAOYUKI
MIURA HIROTSUNA

Application Number:

JP2007189151A

Publication Date:

July 10, 2008

Filing Date:

July 20, 2007

Export Citation:

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Assignee:

SEIKO EPSON CORP

International Classes:

B05D1/26; B05D3/00; H05K3/10

Domestic Patent References:

JP2006239565A	2006-09-14
JP2003133692A	2003-05-09
JP2005057140A	2005-03-03
JP2005502452A	2005-01-27

Attorney, Agent or Firm:

Masahiko Ueyanagi
Osamu Suzawa
Kazuhiko Miyasaka

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