Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PATTERN FORMING METHOD
Document Type and Number:
Japanese Patent JPH0745510
Kind Code:
A
Abstract:

PURPOSE: To prevent the sag of a resist pattern side wall and the decrease of dimension controllability, by a method wherein a resist pattern is formed, the whole surface is coated with resin which does not mingle with resist, heat flow of the resist is generated by heat treatment, and then the resin spread on the resist is eliminated.

CONSTITUTION: Resist 2 is spread on a substrate 1 to be worked. Resist whose main component is positive type novolak system resin is used. The resist in a desired part is selectively eliminated by using ordinary lithography. Water-soluble resin 4 is spread on the whole surface, and then heat-treated at a temperature higher than or equal to the softening temperature of the resist. The water- soluble resin 4 is eliminated by rinsing.


Inventors:
HASEGAWA NORIO
HAYANO KATSUYA
Application Number:
JP1993000192151
Publication Date:
February 14, 1995
Filing Date:
August 03, 1993
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI LTD
International Classes:
G03F7/40; H01L21/027; (IPC1-7): H01L21/027; G03F7/40
Attorney, Agent or Firm:
小川 勝男