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Title:
PATTERNING CONDUCTIVE LAMINATE COMPRISED OF LINEAR STRUCTURE
Document Type and Number:
Japanese Patent JP2013211131
Kind Code:
A
Abstract:

To provide a patterning linear structure capable of improving electrical reliability of a conductive wiring and suppressing electro-chemical migration.

In a patterning conductive laminate: a circle 1 of which diameter is 70 μm in actual size is drawn on the center of an image obtained by randomly selecting and photographing a place in a conductive region of a patterning conducting layer; 18 straight lines passing through the center of the circle and equally dividing the circle 1 into 36 sectors are drawn; the number of intersecting points of the straight lines with linear structures 2 in the inside of the circle is counted for each of the straight lines; and when it is assumed that the straight line having the largest number of the intersecting points is l0 and the straight line having an angle of 90 degrees with respect to l0 is l90, the intersecting number ratio n0/n90 which is a ratio of the number of intersecting points of l0 n0 to the number of intersecting points of l90 n90 is larger than 1.2, and the absolute value of an angle between the pattern direction in which the conductive region of the patterning conducting layer extends and l90 is smaller than 45 degrees.


Inventors:
NISHIOKA KAZUYA
WATANABE OSAMU
Application Number:
JP2012079374A
Publication Date:
October 10, 2013
Filing Date:
March 30, 2012
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
H01B5/14; B32B7/02; G02F1/1343; G06F3/041
Domestic Patent References:
JP2013033102A2013-02-14
JP2006111675A2006-04-27
Foreign References:
WO2011099474A12011-08-18