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Title:
PHENOLIC RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JPS57102944
Kind Code:
A
Abstract:

PURPOSE: To provide the titled molding material which can be plated with copper and is useful for wiring equipments, electrical equipments, etc., by adding a nitrile-butdiene rubber to a phenolic resin molding material.

CONSTITUTION: 1W7pts.wt. nitrile-butadiene rubber is added to 100pts.wt. phenolic resin molding material obtd. by blending a hardener, a filler, a parting agent, a colorant, etc. with a phenolic resin.

EFFECT: This material can be plated with copper without damaging heat resistance, mechanical strength and dimensional stability which the phenolic resin originally possesses.


Inventors:
KOTANI YOSHIO
Application Number:
JP18004080A
Publication Date:
June 26, 1982
Filing Date:
December 18, 1980
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08L61/00; C08L7/00; C08L9/02; C08L21/00; C08L33/00; C08L33/02; C08L61/04; C08L61/06; (IPC1-7): C08L9/02; C08L61/06



 
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