To provide a photoelectric element wherein miniaturization of an LED package is enabled, exfoliation of a metal layer in a trench part of a photoelectric element retaining substrate is prevented, and process in the case of manufacturing can be simplified.
On trenches of an insulating substrate 1 having trenches 9 in the thickness direction of end portions, a photoelectric element retaining member has a first layer 2 excellent in electric insulation, a second layer 3 composed of metal which is hard to be alloyed with solder, and a third layer 4 composed of metal which is excellent in joining properties to solder. The retaining member and the photoelectric element 14 which is connected electrically with the metal layers are sealed with transparent resin 18, including the trench parts.
KOMODA DAISUKE
ASAKAWA HIDEO
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