Title:
感光性アセンブリとカメラモジュール及びその製造方法
Document Type and Number:
Japanese Patent JP6806808
Kind Code:
B2
Abstract:
An photosensitive assembly (1010) and an image capture module and manufacturing methods thereof, wherein the photosensitive assembly (1010) comprises at least one photosensitive element (1011), at least one window-form circuit board (1012) and at least one packaging body (1013); wherein the photosensitive element (1011) and the window-form circuit board (1012) are integrally packaged by the packaging body (1013); the window-form circuit board (1012) comprises a circuit board main body and has at least one window (10122), and the photosensitive element (1011) is disposed in the window (10122).
Inventors:
Pearl pearl
Chen Zhenyu
Ryo Nakayu
Yellow
Guo Kusunoki
Seat
Takehiko Tanaka
Zhao Jie
Jiang Jiang
Kure
Climbing Koryu
Chen Zhenyu
Ryo Nakayu
Yellow
Guo Kusunoki
Seat
Takehiko Tanaka
Zhao Jie
Jiang Jiang
Kure
Climbing Koryu
Application Number:
JP2018568346A
Publication Date:
January 06, 2021
Filing Date:
June 02, 2017
Export Citation:
Assignee:
Ning Hashun Umitsu Den
International Classes:
H04N5/225; G02B7/02; G03B11/00; G03B17/02; G03B19/07
Domestic Patent References:
| JP2008187554A | ||||
| JP2008300574A | ||||
| JP2003189195A | ||||
| JP2013516656A |
Foreign References:
| CN105704354A | ||||
| CN105681637A |
Attorney, Agent or Firm:
Momoko Arima