Title:
感光性組成物、及びそれに用いられる光重合開始剤
Document Type and Number:
Japanese Patent JP6968633
Kind Code:
B2
Abstract:
The present invention provides a photosensitive composition which suppresses adhesion after curing and has excellent curing properties, and a compound and a photopolymerization initiator used therefor. The photosensitive composition of this invention comprises (A) a photopolymerization initiator and (B) a photopolymerizable compound, wherein the photopolymerization initiator is represented by Formula (1). (in Formula (1), Ra1 is independently a hydrogen atom, a nitro group, or a monovalent organic group, and Ra2 and Ra3 are each a chained alkyl group which may have a substituent, a chained alkoxy group which may have a substituent, a cyclic organic group which may have a substituent, or a hydrogen atom, and Ra2 and Ra3 may be mutually bonded to form a ring, Ra4 is a monovalent organic group, Ra5 is a hydrogen atom, an aliphatic hydrocarbon group having 1 to 20 carbon atoms which may have a substituent, or an aryl group which may have a substituent, n1 is an integer of 0 or more and 4 or less, and n2 is 0 or 1). The compound of Formula (1) satisfies at least one of (1) to (3): (1) n1 is an integer of 1 or more and 4 or less, and at least one of Ra1 is a substituent containing H2XC- or the group represented by HX2C-. (2) Ra4 is a substituent containing H2XC- or the group represented by HX2C-. (3) Ra5 is a substituent containing H2XC- or the group represented by HX2C-, wherein each X independently represents a halogen atom.
Inventors:
Keisuke Tadokoro
Shioda Dai
Shioda Dai
Application Number:
JP2017172551A
Publication Date:
November 17, 2021
Filing Date:
September 07, 2017
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
G03F7/029; C07C239/22; C08F2/48; G03F7/031
Domestic Patent References:
| JP2020517804A | ||||
| JP2014052470A | ||||
| JP2016218353A |
Foreign References:
| WO2014050738A1 | ||||
| WO2016010036A1 | ||||
| WO2016158114A1 |
Attorney, Agent or Firm:
Masayuki Masabayashi