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Title:
PHOTOSENSITIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2014137426
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which enables formation of a film with low dielectric constant.SOLUTION: There is provided a photosensitive resin composition comprising a polymer composed of a copolymer of a specific structure, a thermosetting crosslinking agent, and a photosensitizer. The photosensitive resin composition is applied, and heated at 230°C for 60 minutes to form a film with the thickness of 2 μm, and thereafter, relative dielectric constant measured at the frequency of 10 kHz is 4.0 or less.

Inventors:
IKEDA TAKAO
TAGASHIRA NOBUO
IMAMURA YUJI
ONISHI OSAMU
Application Number:
JP2013005008A
Publication Date:
July 28, 2014
Filing Date:
January 15, 2013
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
G03F7/023; C08F232/00; C08G59/42; G03F7/004; H01L21/027
Domestic Patent References:
JPH02146045A1990-06-05
JP2013064988A2013-04-11
JP2007192907A2007-08-02
JP2014504310A2014-02-20
JP2013536287A2013-09-19
JP2008518276A2008-05-29
JP2014520935A2014-08-25
JP2015534598A2015-12-03
Foreign References:
WO2013010190A22013-01-17
WO2014052256A12014-04-03
Attorney, Agent or Firm:
Shinji Hayami



 
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