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Title:
PHOTOSENSITIVE COMPOSITION
Document Type and Number:
Japanese Patent JP3476559
Kind Code:
B2
Abstract:

PURPOSE: To ensure high sensitivity for a photosensitive compsn., to suppress the generation of gaseous HCl, etc., to confine chlorine radicals generated from a triazine polymn. initiator in the reaction system and to suppress the occurrence of a mask deposit by adding epoxy resin to the photosensitive compsn.
CONSTITUTION: An epoxy resin is added to a photosensitive compsn. consisting of a coloring material, dispersant added acrylic resin, a photopolymerizable monomer, a triazine polymn. initiator and a solvent. The polymn. initiator is made of a mixture contg. at least one kind of triazine compd. and at least one kind of aminoacetophenone compd. The epoxy resin is added by an amt. (pts.wt.) 1/2 to 2 times the amt. of the polymn. initiator. The epoxy resin is, e.g. alicyclic epoxy resin, polyalcohol type epoxy resin, polyglycol type epoxy resin, bisphenol type epoxy resin or novolak type epoxy resin.


Inventors:
Mariko Irino
Mizuhito Tani
Shuji Iwakura
Naohiro Kubota
Application Number:
JP23266094A
Publication Date:
December 10, 2003
Filing Date:
September 28, 1994
Export Citation:
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Assignee:
Toppan Printing Co., Ltd.
Asahi Denka Kogyo Co., Ltd.
International Classes:
G03F7/004; G02B5/20; G03F7/027; G03F7/028; G03F7/029; G03F7/032; G03F7/033; (IPC1-7): G03F7/033; G02B5/20; G03F7/028; G03F7/032
Domestic Patent References:
JP2190859A