PURPOSE: To obtain a photosensitive compsn. having superior heat resistance, RIE resistance and definition and wide latitude of development of resist pattern with alkali permitting formation of fine resist pattern by constituting a photosensitive compsn. of a compd. contg. a polymer having a specified structure unit and a photosensitive compd.
CONSTITUTION: A photosensitive compsn. consists of a resin contg. a polymer having structural units expressed by the formula I or II and a structural unit expressed by the formula III, having 103W105 number average mol.wt. of the resin and a photosensitive compd. The content of the polymers expressed by the formulas I, II, and III is 10W100wt%. The number average mol.wt. of the constitutional component contg. the polymer is particularly preferred to be 2,000W60,000. Either a positive photosensitive compd. or a negative photosensitive compd. may be usable as the photosensitive compd. In the formulas, R1 and R5 may be same or different atom expressing halogen atom, etc.; R6 is alkyl group, etc.; R7 and R11 may be same or different atom expressing H atom, etc.
HORIGUCHI RUMIKO
HAYASE SHUJI
