Title:
PHOTOSENSITIVE RESIN COMPOSITION AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2014232233
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition exhibiting an excellent balance between chemical resistance and other characteristics demanded for a photosensitive resin composition, and to provide an electronic device having the photosensitive resin composition.SOLUTION: The photosensitive resin composition comprises a polymer (first polymer) expressed by formula (1) shown below, a first crosslinking agent that crosslinks with the polymer, an acrylic resin as a second crosslinking agent having a reactive group that crosslinks with the polymer or the first crosslinking agent, and a photosensitizer. In formula (1), R, R, Rand Reach independently represent hydrogen or an organic group having 1 to 30 carbon atoms; and A represents a structural unit derived from maleic acid anhydride.
Inventors:
IKEDA TAKAO
ONISHI OSAMU
IMAMURA YUJI
TAGASHIRA NOBUO
ONISHI OSAMU
IMAMURA YUJI
TAGASHIRA NOBUO
Application Number:
JP2013113411A
Publication Date:
December 11, 2014
Filing Date:
May 29, 2013
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
G03F7/004; C08F232/04; G03F7/023
Domestic Patent References:
| JP2004190008A | 2004-07-08 | |||
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| JP2003202672A | 2003-07-18 | |||
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| JP2010224533A | 2010-10-07 |
Foreign References:
| WO2011105443A1 | 2011-09-01 |
Attorney, Agent or Firm:
Shinji Hayami
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