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Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING SAME, METHOD FOR PRODUCING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2001222104
Kind Code:
A
Abstract:

To provide a photosensitive resin composition excellent in sensitivity, plating bath contaminating property, developability and mechanical strength.

In the photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in one molecule and (C) a photopolymerization initiator, a compound of formula I (where each of four symbols R is a 1-6C alkyl and each of four symbols Z is a halogen atom) is contained as an essential component as the component C.


Inventors:
HIDAKA TAKAHIRO
NATORI MICHIKO
MURAKAMI TAIJI
Application Number:
JP2000000035646
Publication Date:
August 17, 2001
Filing Date:
February 08, 2000
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
HODOGAYA CHEMICAL CO LTD
International Classes:
G03F7/029; G03F7/027; G03F7/032; G03F7/033; H05K3/06; H05K3/18; (IPC1-7): G03F7/029; G03F7/027; G03F7/032; G03F7/033; H05K3/06; H05K3/18
Attorney, Agent or Firm:
若林 邦彦