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Title:
PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT USING THIS PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH02154265
Kind Code:
A
Abstract:

PURPOSE: To obtain a photosensitive resin compsn. capable of providing a photosensitive element having a thick film formed on the surface of a base material by incorporating a precursor of a specified photosensitive polyimide and a specified photoinitiator into a specified polyimie precursor.

CONSTITUTION: A precursor of a photosensitive polyimide obtd. by a reaction of an amine compd. epoxy compd., isocyanate compd. or an aziridine compd. having an ethylenic unsatd. group with a precursor of a polyimide having recurrent units expressed by the formula I, and a photoinitiator, are contained in the title photosensitive resin compsn. A photosensitive element having a sandwich structure is prepd. previously by coating the photosensitive resin compsn. on polyester film, etc., drying the coated resin, and providing a cover sheet comprising polyethylene, etc. The cover sheet is then removed, thus, a coating film can be formed on a base plate. Thus, a thick film is formed on the surface of the base material.


Inventors:
SATO KUNIAKI
KOJIMA YASUNORI
ISHIMARU TOSHIAKI
HAYASHI NOBUYUKI
KIKUCHI NOBURU
SAITO TAKAYUKI
KOJIMA MITSUMASA
Application Number:
JP1988000308539
Publication Date:
June 13, 1990
Filing Date:
December 06, 1988
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
G03F7/004; C08F2/46; C08F2/48; C08G73/10; C08L79/08; G03F7/027; G03F7/038; (IPC1-7): C08F2/46; C08G73/10; C08L79/08; G03F7/004; G03F7/027; G03F7/038
Domestic Patent References:
JPS5624343A1981-03-07
JPS59213725A1984-12-03
JPS59131927A1984-07-28
JPS5855926A1983-04-02