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Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTO-SOLDERING RESIST INK, PRINTED WIRING BOARD AND DRY FILM
Document Type and Number:
Japanese Patent JP2003207890
Kind Code:
A
Abstract:

To provide a photosensitive resin composition forming a matte cured film which produces a satisfactory flatting effect to prevent sticking of solder and is excellent also in electric corrosion resistance, gold plating resistance and adhesion to a substrate without using a flatting agent.

The photosensitive resin composition comprises (A) a photosensitive resin obtained by reacting a component (a) comprising an epoxy-containing polymer (a-1) obtained by polymerizing a monomer component (i) comprising an ethylenically unsaturated monomer (i-1) having an epoxy group with an ethylenically unsaturated monomer (b) having a carboxyl group and with a polybasic acid anhydride (c) in order, (b) an epoxy compound having two or more epoxy groups per molecule, (C) a photopolymerization initiator, (D) a diluent and (E) an ethylenically unsaturated group-containing resin obtained by reacting a product (e) obtained by polymerizing a component (ii) comprising an ethylenically unsaturated monomer (ii-1) having a carboxyl group with an ethylenically unsaturated monomer (f) having an epoxy group.


Inventors:
SAKAI YOSHIO
HASHIMOTO SOICHI
Application Number:
JP2002003439A
Publication Date:
July 25, 2003
Filing Date:
January 10, 2002
Export Citation:
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Assignee:
GOO CHEMICAL CO LTD
International Classes:
G03F7/027; C08F2/50; C08F299/00; C08G59/42; G03F7/004; G03F7/038; H05K3/28; (IPC1-7): G03F7/027; C08F2/50; C08F299/00; C08G59/42; G03F7/004; G03F7/038; H05K3/28
Attorney, Agent or Firm:
西川 惠清 (外1名)