Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2005164816
Kind Code:
A
Abstract:
To obtain a photosensitive resin composition used for a permanent protective coat of a printed wiring board, having self-extinguishability (flame resistance) and excellent in resolution.
The photosensitive resin composition contains a specific brominated (meth)acrylate (a), an unsaturated-group-containing polycarboxylic acid resin (b), an epoxy resin (c), an ethylenically unsaturated compound (d) and a photopolymerization initiator (e).
Inventors:
IKEGUCHI NOBUYUKI
OMORI TAKAFUMI
UENO MASAYOSHI
OMORI TAKAFUMI
UENO MASAYOSHI
Application Number:
JP2003401442A
Publication Date:
June 23, 2005
Filing Date:
December 01, 2003
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
G03F7/027; C08F220/22; G03F7/004; G03F7/032; G03F7/038; (IPC1-7): G03F7/027; C08F220/22; G03F7/004; G03F7/032; G03F7/038
Attorney, Agent or Firm:
Takashi Nagai
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