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Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2014137428
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having a high film retention rate after development.SOLUTION: The photosensitive resin composition comprises a polymer, a crosslinking agent and a photosensitive material. After the photosensitive resin composition is formed into a film by a spin coating process, the film is baked on a hot plate at 100°C for 120 seconds to obtain a first layer. The film thickness of the first layer is denoted by a first film thickness (where the first film thickness is 2 μm or more and 3 μm or less). The first layer is exposed through a mask having a line pattern comprising lines having 10 μm width and spaces having 10 μm width arranged therein, to light with a luminous quantity enough to form a pattern of lines having 10 μm width and spaces having 10 μm width in the first layer; the first layer is subsequently developed by an immersion process in a 0.4 mass% aqueous solution of tetramethyl ammonium hydroxide at 23°C for 90 seconds; then the layer is rinsed with pure water for 30 seconds and subjected to spin drying under the condition of 2000 rpm to obtain a second layer. The film thickness of the second layer is denoted by a second film thickness. The first and second film thicknesses satisfy {(second film thickness)/(first film thickness)}×100≥90.

Inventors:
IKEDA TAKAO
TAGASHIRA NOBUO
IMAMURA YUJI
ONISHI OSAMU
Application Number:
JP2013005012A
Publication Date:
July 28, 2014
Filing Date:
January 15, 2013
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
G03F7/023; C08F232/04; G03F7/004; H01L21/027
Domestic Patent References:
JP2000089463A2000-03-31
JP2001337456A2001-12-07
JP2000089461A2000-03-31
JP2000089462A2000-03-31
JP2014520935A2014-08-25
JP2012032729A2012-02-16
JP2015534598A2015-12-03
Foreign References:
WO2013010190A22013-01-17
WO2006129875A12006-12-07
Attorney, Agent or Firm:
Shinji Hayami