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Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0250161
Kind Code:
A
Abstract:

PURPOSE: To improve sensitivity and heat resistance by incorporating 20-200pts. wt. multifunctional acrylate and 1-20pts.wt. sensitizer as the essential components into 100pts.wt. polyamide acid contg. specific silicon diamine.

CONSTITUTION: This compsn. consists of the polyamide acid contg. 5-50wt.% silicon diamine expressed by the formula I as the diamine component, the multifunctional acrylate contg. ≥2 acryl or methacryl group into one molecule and having ≤500mol.wt. and the sensitizer having 330-500nm absorption max. wavelength. The compsn. contains 20-200pts.wt. multifunctional acrylate and 1-20pts.wt. sensitizer per 100pts.wt. polyamide acid as the essential components. The silicon diamine is added to the compsn. in order to lower the modulus of elasticity of the polyimide film and to decrease the water absorptivity thereof. The sensitivity and heat resistance are improved in this way.


Inventors:
SASHITA NOBUYUKI
NAKAO TOSHIO
TOKO AKIRA
Application Number:
JP1988000199940
Publication Date:
February 20, 1990
Filing Date:
August 12, 1988
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
G03F7/027; C08L79/08; G03F7/037; G03F7/038; G03F7/075; H01L21/027; (IPC1-7): C08L79/08; G03F7/027; G03F7/037; G03F7/075