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Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0386760
Kind Code:
A
Abstract:
PURPOSE:To provide the title composition having low modulus of elasticity and excellent adhesiveness, sensitivity, heat resistance, etc., by mixing a specified polyamic acid, a polyfunctional acrylate, a styryl compound, and a oxazoline compound. CONSTITUTION:A photosensitive resin composition produced by mixing 100 pts.wt. polyamic acid copolymerized with 1-50wt.% silicone diamine of formula I (wherein n is 1 to 50); 20-200 pts.wt. polyfunctional acrylate having a plurality of (meth)acrylic groups in the molecule (e.g. ethylene glycol diacrylate) and having a molecular weight of 500 or lower; 1-10 pts.wt. styryl compound of formula II (wherein R1 is H, CH3, C2H5, etc.; and R2 is a group of formulas III, IV, etc.) [e.g. 2-(p-dimethylaminostyryl)benzoxazole]; and 1-20 pts.wt. oxazoline compound of formula V (wherein R3 is a group of formula VI or VII; and R4 is H, CH3, C2H5, etc.) (e.g. 3-phenyl-5-isooxazolone).

Inventors:
TOKO AKIRA
SASHITA NOBUYUKI
TAKEUCHI ETSU
Application Number:
JP22154989A
Publication Date:
April 11, 1991
Filing Date:
August 30, 1989
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
G03F7/027; C08K5/00; C08K5/10; C08K5/3415; C08L79/08; G03F7/075; H01L23/29; H01L23/31; (IPC1-7): C08K5/00; C08K5/10; C08K5/3415; C08L79/08; G03F7/027; G03F7/075; H01L23/29; H01L23/31