To provide a photosensitive resin laminate excellent in adhesion and fine pattern formation.

The photosensitive resin laminate includes a substrate 11, an etching layer 12 having a lamination of a metal compound layer 14 provided on the substrate 11 and an SiO2 layer 15 provided on the metal compound layer 14, and a resist layer 13 provided on the etching layer 12 and including a cation-curable resin composition. The cation-curable resin composition includes at least one type of cation-curable monomer selected from the group of an epoxy compound, oxetane compound and vinyl ether compound, a fluorine-containing cation-curable monomer, and a photoacid generator. The content of the fluorine-containing cation-curable monomer is 10-50 pts.wt. of the whole solid content of the cation-curable resin composition.