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Patent Searching and Data


Title:
PHOTOSENSITIVE THERMOSETTING PASTE COMPOSITION
Document Type and Number:
Japanese Patent JP2004123775
Kind Code:
A
Abstract:

To provide a photosensitive thermosetting paste composition which is easily filled into dents or through-holes, is excellent in depth curability, is not limited in selecting inorganic particles, and does not allow pattern peeling, cracks, and a baked product residue (bubble generation) to occur during baking.

The paste composition contains (A) fine inorganic particles, (B) a binder polymer with a weight average mol.wt. of 3,000-300,000, (C) an ethylenically unsaturated compound, (D) an optical free radical generator, and (E) a thermal free radical generator. Component B is used by dissolving it in at least one kind of component C.


Inventors:
KOJIMA HIDEAKI
KAKINUMA MASAHISA
Application Number:
JP2002000285548
Publication Date:
April 22, 2004
Filing Date:
September 30, 2002
Export Citation:
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Assignee:
TAIYO INK MFG CO LTD
International Classes:
C08F2/44; C09D5/34; G03F7/027; G03F7/26; G03F7/42; G09F9/00; H01B3/00; H01J9/02; H01J11/22; H01J11/34; H01J11/36; H01L21/027; (IPC1-7): C08F2/44; H01J9/02; H01J11/02