PURPOSE: To set an adhesive tape in an adhesive state to be easily peeled at the time of pickup by adding a heating mechanism for heating a semiconductor chip and the tape to a suction nozzle vertically and movably disposed above the chip for sucking and picking up the chip.

CONSTITUTION: A suction nozzle 4 is disposed above a semiconductor chip 3 to be picked up, and heated by a heater 8, for example, to approx. 150-170°C. The nozzle 4 is moved down in this state, its lower end face is brought into contact with the upper face of the chip 3, and the chip 3 and an adhesive tape 7 are heated. Thus, a nitrate 7a having relatively weak adhesive strength is formed on the tape 7 thereby to reduce the adhesive strength of the tape 7 for allowing the chip 3 to be picked up to adhere. The chip 3 is sucked by sucking in vacuum the nozzle 4 to lift the nozzle 4, the picked-up chip 3 is then contained at a predetermined position of a chip tray 5.