Title:
PIEZOELECTRIC VIBRATION DEVICE
Document Type and Number:
Japanese Patent JP2016140104
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To cause no deviation when mounting a temperature sensor part.SOLUTION: An exposed electrode 6 crossing at least the inner wall surface 474 of a second wall part 45 is formed in a second cavity 47 for mounting the temperature sensor part 3 of a base 4 so as to be exposed in the second cavity 47. A pair of electrode pads 621, 622 for temperature sensors for bonding the temperature sensor part 3 by solder 13 are included in the exposed electrode 6. Solder 13 is formed on the whole area on the exposed electrode 6 including the electrode pads 621, 622 for temperature sensors to which the temperature sensor part 3 is bonded. In each of the electrode pads 621, 622 for temperature sensors, when a distance from outer edges 73, 74 to the inner wall surface 474 of the nearest second cavity 47 is set as D2, and the length of the width of the lead-out parts 661, 662 is set as W1, W1>D2 is established in the second cavity 47.SELECTED DRAWING: Figure 3
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Inventors:
TAKASE HIDENORI
Application Number:
JP2016066451A
Publication Date:
August 04, 2016
Filing Date:
March 29, 2016
Export Citation:
Assignee:
DAISHINKU CORP
International Classes:
H03H9/02
Domestic Patent References:
JP2012160870A | 2012-08-23 | |||
JP2012160875A | 2012-08-23 | |||
JP2005183476A | 2005-07-07 | |||
JP2010165812A | 2010-07-29 | |||
JP2012142691A | 2012-07-26 | |||
JP2013102315A | 2013-05-23 | |||
JP2000077942A | 2000-03-14 | |||
JP2012099944A | 2012-05-24 | |||
JPH10322129A | 1998-12-04 | |||
JP2012182567A | 2012-09-20 | |||
JP2012080249A | 2012-04-19 |
Foreign References:
US20110234047A1 | 2011-09-29 |
Attorney, Agent or Firm:
Patent Business Corporation Ark Patent Office
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