Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PLACING-LAYING TYPE DOUBLE FLOOR WITH WIRING GUTTER
Document Type and Number:
Japanese Patent JP2004270131
Kind Code:
A
Abstract:

To provide a lightweight placing-laying type double floor with a wiring gutter, which is made of steel, which can be easily constructed, and which can be adapted to unevenness.

Floor slabs 3 are regularly laid and arranged on a floor surface at prescribed intervals, and a parallel wiring gutter 51 is formed between edges of floor boards. A cross-shaped crossed wiring groove 52 is formed in a place wherein the parallel wiring grooves cross each other. Placing edges 14 are formed on both sides along the wiring grooves 51 and 52, and a rectangular lid and an octagonal lid are detachably placed. The floor slab is supported by many supporting legs which are formed by downward bending and/or bulging a peripheral extension part of a rigid thin plate for forming a surface of the floor board.


Inventors:
YAMAMOTO KIYOSHI
Application Number:
JP2000000180575
Publication Date:
September 30, 2004
Filing Date:
May 12, 2000
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FREE KOGYO KK
OYO KIKAKU KK
International Classes:
E04F15/024; E04F15/18; (IPC1-7): E04F15/024; E04F15/18
Attorney, Agent or Firm:
船津 暢宏
阪本 清孝