PLANE SURFACE GRINDING DEVICE - NICHIDEN MACH LTD

Title:

PLANE SURFACE GRINDING DEVICE

Document Type and Number:

Japanese Patent JP2001009699

Kind Code:

A

Abstract:

To provide a plane surface grinding device capable of flatly grinding a wafer by a required amount.

During grinding a wafer 10 wherein some kinds of material are laminated, through singular light transparent window WT provided on a platen 11, the amount of reflecting light from a ground surface of the wafer 10 is detected by a light detector 29 at the all time, and is detected by a plurality of light sensors Sn during a plurality of light transparent windows Wn passes through a bottom surface of the wafer 10. On the bases of the light amount, pressing force of plural pressurizing chambers provided on every ring- shaped areas within a head portion 14 is controlled, and pressing force on the wafer 10 is suitably set for each ring-shaped area to grind.

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Inventors:

YOSHINO KIICHI
FURUYAMA NAOHIRO
NAGAMOTO NOBUHIRO
SATO UICHI
MIHASHI MASANARI

Application Number:

JP18991699A

Publication Date:

January 16, 2001

Filing Date:

July 05, 1999

Export Citation:

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Assignee:

NICHIDEN MACH LTD
NEC CORP

International Classes:

B24B49/12; B24B1/00; B24B7/22; B24B37/005; B24B37/013; B24B37/30; H01L21/304; (IPC1-7): B24B37/00; B24B37/04; B24B49/12; H01L21/304

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