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Patent Searching and Data


Title:
PLANE SURFACE GRINDING DEVICE
Document Type and Number:
Japanese Patent JP2001009699
Kind Code:
A
Abstract:

To provide a plane surface grinding device capable of flatly grinding a wafer by a required amount.

During grinding a wafer 10 wherein some kinds of material are laminated, through singular light transparent window WT provided on a platen 11, the amount of reflecting light from a ground surface of the wafer 10 is detected by a light detector 29 at the all time, and is detected by a plurality of light sensors Sn during a plurality of light transparent windows Wn passes through a bottom surface of the wafer 10. On the bases of the light amount, pressing force of plural pressurizing chambers provided on every ring- shaped areas within a head portion 14 is controlled, and pressing force on the wafer 10 is suitably set for each ring-shaped area to grind.


Inventors:
YOSHINO KIICHI
FURUYAMA NAOHIRO
NAGAMOTO NOBUHIRO
SATO UICHI
MIHASHI MASANARI
Application Number:
JP1999000189916
Publication Date:
January 16, 2001
Filing Date:
July 05, 1999
Export Citation:
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Assignee:
NICHIDEN MACH LTD
NEC CORP
International Classes:
B24B49/12; B24B1/00; B24B7/22; B24B37/005; B24B37/013; B24B37/30; H01L21/304; (IPC1-7): B24B37/00; B24B37/04; B24B49/12; H01L21/304