Title:
プラズマ処理装置
Document Type and Number:
Japanese Patent JP5767819
Kind Code:
B2
Abstract:
Provided is a plasma processing device (S1) configured to perform surface reforming on a workpiece (X) made of a metal material in a vacuum furnace (1) by plasma includes movable power feeding devices (14 and 15) that are movable in the vacuum furnace (1).
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Inventors:
Kazuhiko Katsumata
Application Number:
JP2011020665A
Publication Date:
August 19, 2015
Filing Date:
February 02, 2011
Export Citation:
Assignee:
Ihi Co., Ltd.
Ihi Mechanical Systems Co., Ltd.
Ihi Mechanical Systems Co., Ltd.
International Classes:
C23C8/36; C21D1/09; C21D1/773; F27D11/08
Domestic Patent References:
| JP2009267048A | ||||
| JP60125366A |
Foreign References:
| US7204952 |
Other References:
社団法人表面技術協会編,表面技術便覧,日本,日刊工業新聞社,1998年 2月27日,初版1刷,p.794
Attorney, Agent or Firm:
Masatake Shiga
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