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Patent Searching and Data


Title:
PLATE MATERIAL MACHINING SYSTEM
Document Type and Number:
Japanese Patent JP2012051320
Kind Code:
A
Abstract:

To provide a plate material machining system configured to reduce the overall machining time of the system.

The plate material machining system 1 includes: an input unit 12 positioned upstream of a conveying line L and inputting a plate raw material W1 to be machined in the conveying line L; a positioning and conveying unit 22 positioned upstream of the conveying line L and conveying and positioning the plate raw material W1 input in the conveying line L; a machining unit 32 for performing predetermined machining on the positioned plate raw material W1 to form a machined plate material W2; and a discharge unit 42 positioned downstream of the conveying line L and conveying and discharging the machined plate material W2. A printing means 52 for printing predetermined necessary information in a predetermined position of the plate raw material W1 to be machined next is arranged in a proper position upstream of the machining unit 32 for performing machining pretreatment on the plate raw material W1, so as to reduce the overall machining time of the system and increase speed.


Inventors:
EZAWA AKIRA
INOHARA HIROSHI
Application Number:
JP2010197359A
Publication Date:
March 15, 2012
Filing Date:
September 03, 2010
Export Citation:
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Assignee:
TOA ENGINEERING CO LTD
International Classes:
B27C9/04
Attorney, Agent or Firm:
Hiroaki Kumagai