Title:
PLATING RECEPTIVE FILM AND METHOD FOR MANUFACTURING METAL FILM MATERIAL USING THE SAME
Document Type and Number:
Japanese Patent JP2011213019
Kind Code:
A
Abstract:
To provide a plating receptive film that can form, on a desired substrate surface, a plating receiving layer excelling in receptivity of a plating catalyst or its precursor, and a method for manufacturing a metal film material that can easily form a substrate with a metal layer excelling in adhesiveness between a metal layer and the substrate, using the plating receptive film.
The plating receptive film is formed by imparting a low molecular compound having at least two reactive groups in a molecule, to one surface of a resin layer having a functional group that forms an interaction with the plating catalyst or its precursor.
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Inventors:
TSURUMI MITSUYUKI
Application Number:
JP2010084575A
Publication Date:
October 27, 2011
Filing Date:
March 31, 2010
Export Citation:
Assignee:
FUJIFILM CORP
International Classes:
B32B27/00; C23C18/20
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda
Kato Kazunori
Hiroshi Fukuda
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