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Title:
POLISHING CARRIER AND POLISHING DEVICE
Document Type and Number:
Japanese Patent JP2014140919
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing carrier and a polishing device for preventing a contour portion of a wafer from becoming thick in polishing, and precisely polishing the wafer.SOLUTION: A polishing carrier 1 is equipped with a work holding hole 10 having a projecting portion 12a at least at a part of an inner peripheral end surface 11. The projecting portion 12a surrounding a wafer forms a slurry sump, and slurry is easily supplied to a wafer contour portion. Therefore, the wafer can be further precisely machined.

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Inventors:
YUKI HIROAKI
Application Number:
JP2013009915A
Publication Date:
August 07, 2014
Filing Date:
January 23, 2013
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
B24B37/28; H01L21/304
Attorney, Agent or Firm:
Masahiko Ueyanagi
Kazuhiko Miyasaka
Kazuaki Watanabe



 
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