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Title:
POLISHING COMPOSITION FOR SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE USING THE SAME
Document Type and Number:
Japanese Patent JP2004311575
Kind Code:
A
Abstract:

To provide a polishing composition capable of inexpensively and easily performing polishing work of a polishing object being relatively hard and having difficulty in polishing such as a gallium nitride semiconductor substrate, and to enable mainly polishing the gallium nitride semiconductor substrate using this polishing composition.

In the polishing composition 6, for example, soft abrasive grains such as colloidal silica and, for example, hard abrasive grains such as diamond or alpha alumina are dispersed in pure water as a dispersion medium, and a polishing promoter and bactericides are contained.


Inventors:
KATO HIROKI
NAKANO HIROYUKI
SHIRAI KATSUYUKI
TERAMOTO TADASHI
MATSUMOTO NAOKI
TAKEMOTO KIKUROU
MIURA YASUNORI
Application Number:
JP2003000100373
Publication Date:
November 04, 2004
Filing Date:
April 03, 2003
Export Citation:
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Assignee:
RODEL NITTA CO
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
B24B37/00; C09K3/14; H01L21/304; (IPC1-7): H01L21/304; B24B37/00; C09K3/14
Attorney, Agent or Firm:
岡田 和秀