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Title:
POLISHING COMPOUND AND POLISHING METHOD
Document Type and Number:
Japanese Patent JP2010251778
Kind Code:
A
Abstract:

To provide a polishing compound which enables embedded wiring with low dishing, low erosion and few scratches to be formed at high polishing speed through the use of the polishing compound in polishing a substrate, having an insulative film on which a wiring metal film and a barrier film are formed.

The polishing compound includes steps of dissolving a heterocyclic benzene compound, such as benzotriazole, in one or more organic solvents selected from among a group consisting of a primary alcohol having 1 to 4 carbon atoms, a glycol having 2 to 4 carbon atoms, an ether represented by CH3CH(OH)CH2OCmH2m+1, wherein m is an integer of 1 to 4, N-methyl-2-pyrrolidone, N,N-dimethylformamide, dimethyl sulfoxide, γ-butyloractone and propylene carbonate; and then mixing the resulting solution with an aqueous dispersion of fine oxide particles as abrasive grains.


Inventors:
TAKEMIYA SATOSHI
NAKAZAWA NORIHITO
KIN YOSHINORI
Application Number:
JP2010131771A
Publication Date:
November 04, 2010
Filing Date:
June 09, 2010
Export Citation:
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Assignee:
AGC SEIMI CHEMICAL CO LTD
ASAHI GLASS CO LTD
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14; H01L21/321
Domestic Patent References:
JPH1140526A1999-02-12
JP2001185515A2001-07-06
Foreign References:
WO2000039844A12000-07-06
Attorney, Agent or Firm:
Hayashi Tsunetoku
Takamasa Asano
Kenji Doi