Title:
POLISHING DEVICE, POLISHING METHOD, AND MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3667113
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve the flatness of the surface of a semiconductor film which is polished by a chemical-mechanical polishing method.
SOLUTION: When a semiconductor film 19 formed on a semiconductor substrate 3S is polished by a chemical-mechanical polishing method, a polishing is performed in a state where the polishing selective ratio of the semiconductor film 19 and an underlying insulating film 17 is made relatively large at the beginning step. Then, the selective ratio is made relatively smaller in the middle step to equally polish the semiconductor 19 and the insulating film 17 independently of the kind of a film to be polished.
Inventors:
Nobuhiro Konishi
Yusuke Nonaka
Yusuke Nonaka
Application Number:
JP28445498A
Publication Date:
July 06, 2005
Filing Date:
October 06, 1998
Export Citation:
Assignee:
Renesas Technology Corp.
International Classes:
H01L21/304; (IPC1-7): H01L21/304
Domestic Patent References:
| JP9326392A | ||||
| JP2000068272A |
Attorney, Agent or Firm:
Yamato Tsutsui
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