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Title:
POLISHING DEVICE AND POLISHING METHOD
Document Type and Number:
Japanese Patent JP2018192545
Kind Code:
A
Abstract:
To provide a polishing device capable of attaining a desired polishing profile by preventing inclination of a polishing head at a substrate polishing time.SOLUTION: A polishing device includes a substrate holding part 3 for holding a substrate W, a polishing head 50 for pressing a polishing tool 38 onto the substrate W, a support structure 24 for supporting the polishing head 50, a base structure 23 having the support structure 24 fixed thereto, and a reinforcement structure 110 fixed to the support structure 24. The reinforcement structure 110 has an anchor mechanism 112 constituted fixably to/separably from the base structure 23.SELECTED DRAWING: Figure 13

Inventors:
KASHIWAGI MAKOTO
YOSHIDA ATSUSHI
DU FENG JIE
YAMASHITA MICHIYOSHI
Application Number:
JP2017096604A
Publication Date:
December 06, 2018
Filing Date:
May 15, 2017
Export Citation:
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Assignee:
EBARA CORP
International Classes:
B24B41/02; B24B21/00; B24B49/08; B24B55/00
Attorney, Agent or Firm:
Tetsuya Hirosawa
Isamu Watanabe



 
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